Linde delivers solid 2017 results
The Linde Group delivered a solid performance in the 2017 financial year, achieving increases in both group revenue and group operating profit after adjusting for exchange rate effects.
The Linde Group delivered a solid performance in the 2017 financial year, achieving increases in both group revenue and group operating profit after adjusting for exchange rate effects.
Airgas, an Air Liquide company, is increasing its presence in California with the construction of a new liquid carbon dioxide (CO2) production facility and the expansion of an air separation unit (ASU).
Plans have been revealed which will see Europe’s first waste to methanol plant opened in Rotterdam, Netherlands.
Construction work is expected to begin this spring on the $100m upgrade to Linde LLC’s industrial gases plant in Delaware, US, which will see its merchant liquid and gaseous product production capabilities increased.
Air Liquide has signed a multi-year contract with Italian start-up Numanova, who specialise in the production of metal powders used as raw material in additive manufacturing or 3D printing.
Air Products will highlight its range of industrial gas and equipment solutions, aimed at helping seafood processors improve yield, reduce spoilage and save money, at Seafood Expo North America in Boston, Mass., from 11th to...
Air Products will showcase how the use of industrial gases in food processing applications can help natural, organic and healthy food producers increase productivity and improve food quality at the Natural Products Expo West in...
The Engineering Division of The Linde Group and Mitsubishi Chemical Corporation (MCC) have concluded a definite agreement for transfer of MCC’s Hydrodealkylation (HDA) technology to Linde.
The Linde Group has partnered with the STARTUP AUTOBAHN innovation platform powered by Plug and Play at the Stuttgart and Singapore hubs, and with Plug and Play’s energy cluster in Sunnyvale in the US.
Air Products will introduce a break-through fluxless soldering technology using electron attachment (EA) technology for wafer level packaging applications at the IPC APEX Expo in San Diego, California, from 27th February to 1st March.