Intel unveils plans for $4.6bn semiconductor facility in Poland
Intel will invest up to $4.6bn in a new semiconductor assembly and test facility in Poland to meet critical demand for assembly and test capacity that is expected by 2027.
Intel will invest up to $4.6bn in a new semiconductor assembly and test facility in Poland to meet critical demand for assembly and test capacity that is expected by 2027.
A new report from materials advisory firm TECHCET forecasts an upward five-year CAGR (Compound Annual Growth Rate) of 6.4% for the electronics gas market, warning that critical gases such as diborane and tungsten hexafluoride may...
Taiwan-based semiconductor manufacturer HTC has opened a new North American headquarters in Phoenix, Arizona, to support the growing electronics market.
Semiconductor manufacturers GlobalFoundries and STMicroelectronics have concluded an agreement to jointly build, own, and operate a new €7.5bn high-volume semiconductor manufacturing facility in Crolles, France.
Air Liquide has invested nearly $70m in two industrial gas plants in North Texas to supply ultra-high purity nitrogen and oxygen to the growing electronics industry.
US manufacturing firm Applied Materials has unveiled plans to build what it says will be the world’s largest and most advanced facility for collaborative semiconductor process technology and manufacturing equipment research and development (R&D).
Imec, a Belgium-based research and innovation hub in nanoelectronics and digital technologies, has welcomed semiconductor specialists GlobalFoundries, Samsung Electronics, and TSMC to its Sustainable Technologies & Systems (SSTS) research programme.
The Lumibird Group has signed an agreement with Prima Industrie to acquire its subsidiary Convergent Photonicsand the Convergent assets of Prima Industrie North America.
German engineering and technology company Bosch has unveiled plans to acquire US chipmaker TSI Semiconductors to boost silicon carbide (SiC) production in California.
TECHCET’s Lita Shon-Roy picks the bones out of the EU Chips Act and explores issues in the lack of timing and materials to support it.