The US Department of Commerce (DOC) has unveiled a $1.4bn programme to accelerate the development of advanced packaging for semiconductors, part of its CHIPS for America initiative.
Under the CHIPS National Advanced Packaging Manufacturing Program, $300m will go to Absolics Inc., Applied Materials Inc. and Arizona State University for research into advanced substrates and materials.
“These investments are a key milestone as we build an ecosystem that supports modern semiconductor manufacturing in the United States,” said Secretary of Commerce Gina Raimondo in a statement.
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