The US-JOINT consortium, formed of semiconductor suppliers looking to advanced packaging and back-end processing technologies in California’s Silicon Valley, has welcomed 3M as its newest member.
Formed in 2023 by semiconductor and electronics specialist Resonac, US-JOINT supports end-customer collaboration to verify requirements for semiconductor packaging of advanced devices and validate new concepts in development.
The group has a research and development (R&D) site in Union City, California, which was set up through co-investment with the partners. Work was underway at the facility last year, and it is expected to be fully operational in 2025.
Hidenori Abe, Chief Technology Officer for semiconductor materials at Resonac, welcomed 3M to the consortium.
“3M’s expertise in materials science and commitment to innovation in advanced packaging device and process solutions will be an asset as we work together to solve difficult technical and integration challenges for customers onshore in the US.”
Steven Vander Louw, President of Display and Electronics Product Platforms at 3M, noted the importance of the consortium as market requirements shift.
He added, “As the demands of AI and other high-performance computing technologies increase, suppliers must work together to provide comprehensive solutions to tough challenges on increasingly shorter timelines.”
Other members of US-JOINT include Azimuth, KLA, Kulicke & Soffa, Moses Lake Industries, MEC, ULVAC, NAMICS, TOK, TOWA, and Resonac.
