GlobalWafers is set to receive up to $400m in direct funding under the CHIPS and Science Act to support the opening of two new US-based manufacturing sites for semiconductor wafer production.
The Taiwanese tech manufacturing company has signed a non-binding preliminary memorandum of terms (PMT) with the US Department of Commerce to receive the capital boost.
If approved, the investment will support the construction of a Sherman, Texas-based 300mm silicon wafer manufacturing facility for advanced chips. The wafers will be used by foundries and integrated device manufacturers.
A second site will be based in Peters, Missouri, and will manufacture 300-mm silicon-on-insulator (SOI) wafers. SOI wafers are commonly used in defence and aerospace applications.
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