FlipChip International (FCI) of Phoenix, Arizona, and Fujikura Ltd have announced conclusion of a Joint Strategic Sales and Business Development Agreement.
This agreement will allow both parties to combine technology development, design, sales and marketing for their recently launched ChipletT™ and ChipsetT™ ultra low profile embedded semiconductor package product lines based on both the Fujikura’s WABE Technology™ and the WLCSP expertise of FCI.
This is a further consolidation of the partnership between the companies and an important milestone in providing customers with industry leading supply chain logistics coupled with a seamless and efficient design to manufacture service.
This collaboration between FCI and Fujikura is another step towards a true turn-key service business model which provides the customer with improved design and commercial responsiveness, supply chain and yield management, consolidated design teams and reduced lead times for prototyping and production.
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