The European Commission has approved under EU State aid rules a €5bn German measure to support European Semiconductor Manufacturing Company (ESMC) build and operate a microchip manufacturing plant in Dresden.
ESMC, a joint venture between Taiwan Semiconductor Manufacturing Company (TSMC), Bosch, Infineon, and NXP, targets growing demand for industrial and automotive applications.
The new large-scale manufacturing facility supported under the measure will deliver high-performance chips, based on 300mm silicon wafers with node sizes covering 28/22nm and 16/12nm, using field-effect transistor (FinFET) technology and allowing the integration of several additional features in one chip.
The produced chips will offer better performance while reducing total power consumption. The plant, which is planned to be operating at full capacity by 2029, is expected to produce 480,000 silicon wafers per year.
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