Semiconductor manufacturing business ams Osram has secured €227m ($237.4m) from the European Commission to develop a new wafer manufacturing facility in Premstätten, Austria.
The European Commission today (24th Geb) approved the direct grant to support the company’s total €1.4bn investment. ams Osram hopes to have the plant operating at full capacity in 2030.
ams Osram’s facility uses a “toolbox approach” that combines two technologies: metal oxide semiconductors for transistors and a technique called through silicon via, which connects chips vertically. This also includes optical filters, offering unique features for the final chip.
It is thought that the facility will be Europe’s first with such an integrated process.
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