The Biden-Harris Administration is looking to invest up to $300m in advanced packaging research projects in Georgia, California, and Arizona to help develop technologies essential for the semiconductor market.
Absolics in Georgia, Applied Materials in California, and Arizona State University are set to benefit if the negotiations are successful. Each recipient will receive up to $100m of the competitively awarded research investments.
Up to $300m in federal funding will be paired with additional investments from the private sector, bringing the expected total investment for the projects to over $470m.
Advanced packaging relies on advanced substrates, allowing high-performance computing for AI, next-gen wireless communication, and efficient power electronics. These substrates are not yet produced in the US, but the proposed investment will help US manufacturers stay competitive.
