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US unveils $1.4bn boost for semiconductor innovation

The US Department of Commerce (DOC) has unveiled a $1.4bn programme to accelerate the development of advanced packaging for semiconductors, part of its CHIPS for America initiative.

The US Department of Commerce (DOC) has unveiled a $1.4bn programme to accelerate the development of advanced packaging for semiconductors,…

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US unveils $1.4bn boost for semiconductor innovation
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